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 74VHC273 Octal D-Type Flip-Flop
April 2007
74VHC273 Octal D-Type Flip-Flop
Features
High Speed: fMAX = 165MHz (typ) at VCC = 5V Low power dissipation: ICC = 4A (max) at TA = 25C High noise immunity: VNIH = VNIL = 28% VCC (min) Power down protection is provided on all inputs Low noise: VOLP = 0.9V (max) Pin and function compatible with 74HC273 Leadless DQFN Package
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General Description
The VHC273 is an advanced high speed CMOS Octal D-type flip-flop fabricated with silicon gate CMOS technology. It achieves the high speed operation similar to equivalent Bipolar Schottky TTL while maintaining the CMOS low power dissipation. The register has a common buffered Clock (CP) which is fully edge-triggered. The state of each D input, one setup time before the LOW-to-HIGH clock transition, is transferred to the corresponding flip-flop's Q output. The Master Reset (MR) input will clear all flip-flops simultaneously. All outputs will be forced LOW independently of Clock or Data inputs by a LOW voltage level on the MR input. An input protection circuit insures that 0V to 7V can be applied to the inputs pins without regard to the supply voltage. This device can be used to interface 5V to 3V systems and two supply systems such as battery backup. This circuit prevents device destruction due to mismatched supply and input voltages.
Ordering Information
Order Number
74VHC273M 74VHC273SJ 74VHC273BQ (Preliminary) 74VHC273MTC
Package Number
M20B M20D MLP020B (Preliminary) MTC20
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Surface mount packages are also available on Tape and Reel. Specify by appending the suffix letter "X" to the ordering number. Pb-Free package per JEDEC J-STD-020B.
(c)1994 Fairchild Semiconductor Corporation 74VHC273 Rev. 1.5
www.fairchildsemi.com
74VHC273 Octal D-Type Flip-Flop
Connection Diagrams
Pin Assignments for PDIP, SOIC, SOP, and TSSOP
Logic Symbols
IEEE/IEC
Pad Assignments for DQFN
Function Table
Operating Mode
Reset (Clear) Load `1' Load `0'
Inputs MR
L H H
Outputs Dn
X H L
CP
X
Qn
L H L
H = HIGH Voltage Level (Top Through View) L = LOW Voltage Level X = Immaterial = LOW-to-HIGH Transition
Pin Descriptions
Pin Names
D0-D7 MR CP Q0-Q7
Description
Data Inputs Master Reset Clock Pulse Input Data Outputs
(c)1994 Fairchild Semiconductor Corporation 74VHC273 Rev. 1.5
www.fairchildsemi.com 2
74VHC273 Octal D-Type Flip-Flop
Logic Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Figure 1.
(c)1994 Fairchild Semiconductor Corporation 74VHC273 Rev. 1.5
www.fairchildsemi.com 3
74VHC273 Octal D-Type Flip-Flop
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
Symbol
VCC VIN VOUT IIK IOK IOUT ICC TSTG TL Supply Voltage DC Input Voltage DC Output Voltage Input Diode Current Output Diode Current DC Output Current DC VCC/GND Current Storage Temperature
Parameter
Rating
-0.5V to +7.0V -0.5V to +7.0V -0.5V to VCC + 0.5V -20mA 20mA 25mA 75mA -65C to +150C 260C
Lead Temperature (Soldering, 10 seconds)
Recommended Operating Conditions(1)
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings.
Symbol
VCC VIN VOUT TOPR tr , tf Supply Voltage Input Voltage Output Voltage Operating Temperature Input Rise and Fall Time, VCC = 3.3V 0.3V VCC = 5.0V 0.5V
Parameter
Rating
2.0V to +5.5V 0V to +5.5V 0V to VCC -40C to +85C 0ns/V 100ns/V 0ns/V 20ns/V
Note: 1. Unused inputs must be held HIGH or LOW. They may not float.
(c)1994 Fairchild Semiconductor Corporation 74VHC273 Rev. 1.5
www.fairchildsemi.com 4
74VHC273 Octal D-Type Flip-Flop
DC Electrical Characteristics
TA = 25C Symbol
VIH VIL VOH
-40C to +85C Max. Min.
1.50 0.7 x VCC 0.50 0.3 x VCC 0.50 0.3 x VCC 1.9 2.9 4.4 2.48 3.80 V V
Parameter
HIGH Level Input Voltage LOW Level Input Voltage HIGH Level Output Voltage
VCC (V)
2.0 3.0-5.5 2.0 3.0-5.5 2.0 3.0 4.5 3.0 4.5
Conditions
Min.
1.50 0.7 x VCC
Typ.
Max.
Units
V
VIN = VIH IOH = -50A or VIL IOH = -4mA IOH = -8mA VIN = VIH IOL = 50A or VIL
1.9 2.9 4.4 2.58 3.94
2.0 3.0 4.5
VOL
LOW Level Output Voltage
2.0 3.0 4.5 3.0 4.5
0.0 0.0 0.0
0.1 0.1 0.1 0.36 0.36 0.1 4.0
0.1 0.1 0.1 0.44 0.44 1.0 40.0
V
IOL = 4mA IOL = 8mA VIN = 5.5V or GND VIN = VCC or GND
IIN ICC
Input Leakage Current Quiescent Supply Current
0-5.5 5.5
A A
Noise Characteristics
TA = 25C Symbol
VOLP(2) VOLV(2) VIHD(2) VILD(2)
Parameter
Quiet Output Maximum Dynamic VOL Quiet Output Minimum Dynamic VOL Minimum HIGH Level Dynamic Input Voltage Maximum LOW Level Dynamic Input Voltage
VCC (V)
5.0 5.0 5.0 5.0
Conditions
CL = 50pF CL = 50pF CL = 50pF CL = 50pF
Typ.
0.6 -0.6
Limits
0.9 -0.9 3.5 1.5
Units
V V V V
Note: 2. Parameter guaranteed by design.
(c)1994 Fairchild Semiconductor Corporation 74VHC273 Rev. 1.5
www.fairchildsemi.com 5
74VHC273 Octal D-Type Flip-Flop
AC Electrical Characteristics
TA = 25C Symbol
fMAX
TA = -40C to +85C Min.
65 45 100 70 13.6 17.1 9.0 11.0 13.6 17.1 8.5 10.5 1.5 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 16.0 19.5 10.5 12.5 16.0 19.5 10.0 12.0 1.5 1.0 10.0 pF pF ns ns ns ns ns MHz
Parameter
Maximum Clock Frequency
VCC (V)
3.3 0.3 5.0 0.5
Conditions
CL = 15pF CL = 50pF CL = 15pF CL = 50pF CL = 15pF CL = 50pF CL = 15pF CL = 50pF CL = 15pF CL = 50pF CL = 15pF CL = 50pF
(3)
Min.
75 50 120 80
Typ.
120 75 165 110 8.7 11.2 5.8 7.3 8.9 11.4 5.2 6.7
Max.
Max. Units
MHz
tPLH, tPHL
Propagation Delay Time (CK - Q)
3.3 0.3 5.0 0.5
tPHL
Propagation Delay Time (MR - Q)
3.3 0.3 5.0 0.5
tOSLH, tOSHL CIN CPD
Output to Output Skew Input Capacitance Power Dissipation Capacitance
3.3 0.3 5.0 0.5
CL = 50pF CL = 50pF = Open 4.0 31
VCC (4)
10.0
Notes: 3. Parameter guaranteed by design tOSLH = |tPLHmax - tPLHmin|; tOSHL = |tPHLmax - tPHLmin|. 4. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained from the equation: ICC (opr.) = CPD * VCC * fIN + ICC / 8 (per F/F). The total CPD when n pieces of the Flip-Flop operates can be calculated by the equation: CPD (total) = 22 + 9n.
AC Operating Requirements
TA = 25C Symbol
tW(L), tW(H) tW(L) tS tH tREC
TA = -40C to +85C Units
ns ns ns ns ns 6.5 5.0 6.0 5.0 6.5 4.5 1.0 1.0 2.5 2.0
Parameter
Minimum Pulse Width (CK) Minimum Pulse Width (MR) Minimum Setup Time Minimum Hold Time Minimum Removal Time (MR)
VCC
(V)(5)
Typ.
Guaranteed Minimum
5.5 5.0 5.0 5.0 5.5 4.5 1.0 1.0 2.5 2.0
3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0
Note: 5. VCC is 3.3 0.3V or 5.0 0.5V
(c)1994 Fairchild Semiconductor Corporation 74VHC273 Rev. 1.5
www.fairchildsemi.com 6
74VHC273 Octal D-Type Flip-Flop
Tape and Reel Specification
Tape Format for DQFN
Package Designator
BQ
Tape Section
Leader (Start End) Carrier Trailer (Hub End)
Number Cavities
125 (typ.) 2500/3000 75 (typ.)
Cavity Status
Empty Filled Empty
Cover Tape Status
Sealed Sealed Sealed
Tape Dimensions
Dimensions are in millimeters unless otherwise noted.
Figure 2.
(c)1994 Fairchild Semiconductor Corporation 74VHC273 Rev. 1.5
www.fairchildsemi.com 7
74VHC273 Octal D-Type Flip-Flop
Tape and Reel Specification (Continued)
Reel Dimensions for DQFN
Dimensions are in inches (millimeters) unless otherwise noted.
Tape Size
12mm
A
13.0 (330)
B
0.059 (1.50)
C
0.512 (13.00)
D
0.795 (20.20)
N
7.008 (178)
W1
0.488 (12.4)
W2
0.724 (18.4)
Figure 3.
(c)1994 Fairchild Semiconductor Corporation 74VHC273 Rev. 1.5
www.fairchildsemi.com 8
74VHC273 Octal D-Type Flip-Flop
Physical Dimensions
Dimensions are in inches (millimeters) unless otherwise noted.
Figure 4. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package Number M20B
(c)1994 Fairchild Semiconductor Corporation 74VHC273 Rev. 1.5
www.fairchildsemi.com 9
74VHC273 Octal D-Type Flip-Flop
Physical Dimensions (Continued) Dimensions are in millimeters unless otherwise noted.
Figure 5. 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D
(c)1994 Fairchild Semiconductor Corporation 74VHC273 Rev. 1.5
www.fairchildsemi.com 10
74VHC273 Octal D-Type Flip-Flop
Physical Dimensions (Continued) Dimensions are in millimeters unless otherwise noted.
Figure 6. 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm Package Number MLP020B (Preliminary)
(c)1994 Fairchild Semiconductor Corporation 74VHC273 Rev. 1.5
www.fairchildsemi.com 11
74VHC273 Octal D-Type Flip-Flop
Physical Dimensions (Continued) Dimensions are in millimeters unless otherwise noted.
Figure 7. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20
(c)1994 Fairchild Semiconductor Corporation 74VHC273 Rev. 1.5
www.fairchildsemi.com 12
74VHC273 Octal D-Type Flip-Flop
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DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only.
Rev. I24
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
No Identification Needed
Full Production
Obsolete
Not In Production
(c)1994 Fairchild Semiconductor Corporation 74VHC273 Rev. 1.5
www.fairchildsemi.com 13


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